Invention Grant
- Patent Title: Multi-level boost converter
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Application No.: US15863002Application Date: 2018-01-05
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Publication No.: US10554128B2Publication Date: 2020-02-04
- Inventor: Bo Yu , Jinxiang Zhan , Dianbo Fu
- Applicant: Futurewei Technologies, Inc.
- Applicant Address: US TX Plano
- Assignee: Futurewei Technologies, Inc.
- Current Assignee: Futurewei Technologies, Inc.
- Current Assignee Address: US TX Plano
- Agency: Vierra Magen Marcus LLP
- Main IPC: H02M3/158
- IPC: H02M3/158 ; H02M3/07 ; H02M1/32 ; H02M1/36 ; H02M1/00

Abstract:
A DC to DC converter uses a multi-level boost converter topology. In addition to the input voltage being connected to an output node through a boost inductor in series with a pair of diodes, a bridge circuit generates a multi-level waveform on one side of flying capacitor, which is on the other side connected between the series connected diodes. The boost converter topology maintains low voltage stress on its components under abnormal conditions on the output node and allows for simple pre-charging of the flying capacitor.
Public/Granted literature
- US20190214904A1 MULTI-LEVEL BOOST CONVERTER Public/Granted day:2019-07-11
Information query
IPC分类: