-
公开(公告)号：US20190214904A1
公开(公告)日：2019-07-11
申请号：US15863002
申请日：2018-01-05
Applicant: Futurewei Technologies, Inc.
Inventor： Bo Yu , Jinxiang Zhan , Dianbo Fu
Abstract: A DC to DC converter uses a multi-level boost converter topology. In addition to the input voltage being connected to an output node through a boost inductor in series with a pair of diodes, a bridge circuit generates a multi-level waveform on one side of flying capacitor, which is on the other side connected between the series connected diodes. The boost converter topology maintains low voltage stress on its components under abnormal conditions on the output node and allows for simple pre-charging of the flying capacitor.
-
公开(公告)号：US10554128B2
公开(公告)日：2020-02-04
申请号：US15863002
申请日：2018-01-05
Applicant: Futurewei Technologies, Inc.
Inventor： Bo Yu , Jinxiang Zhan , Dianbo Fu
Abstract: A DC to DC converter uses a multi-level boost converter topology. In addition to the input voltage being connected to an output node through a boost inductor in series with a pair of diodes, a bridge circuit generates a multi-level waveform on one side of flying capacitor, which is on the other side connected between the series connected diodes. The boost converter topology maintains low voltage stress on its components under abnormal conditions on the output node and allows for simple pre-charging of the flying capacitor.
-
Search Results
2
records
(took 0.009 seconds)
