Invention Grant
- Patent Title: Gas distribution apparatus and substrate processing apparatus including the same
-
Application No.: US16190558Application Date: 2018-11-14
-
Publication No.: US10557198B2Publication Date: 2020-02-11
- Inventor: Heon Bok Lee , Dae Yong Kim , Dong Woo Kim , Jun Ki Park , Sang Yub Ie , Sang Jin Hyun
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Priority: KR10-2018-0033952 20180323
- Main IPC: H01L21/285
- IPC: H01L21/285 ; C23C16/455

Abstract:
A substrate processing apparatus is provided. The substrate processing apparatus includes a substrate chuck, a shower head structure over the substrate chuck, and a gas distribution apparatus connected to the shower head structure. The gas distribution apparatus includes a dispersion container including a first dispersion space and a gas inlet section on the dispersion container. The gas inlet section includes a first inlet pipe including a first inlet path fluidly connected to the first dispersion space and a second inlet pipe including a second inlet path fluidly connected to the first dispersion space. The second inlet pipe surrounds at least a portion of a sidewall of the first inlet pipe.
Public/Granted literature
- US20190292664A1 GAS DISTRIBUTION APPARATUS AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME Public/Granted day:2019-09-26
Information query
IPC分类: