An encapsulated package is provided that includes an integrated circuit (IC) die. An encapsulation material encapsulates the IC die. A set of broadband spectral sensors on the IC die are configured to generate a set of signals in response to electromagnetic energy received by the spectral sensors. A photonic filter structure within the encapsulation material is positioned adjacent the set of spectral sensors. The photonic filter structure is configured to pass a different frequency band of electromagnetic energy to each of the set of spectral sensors.