Invention Grant
- Patent Title: Processing object data
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Application No.: US16420794Application Date: 2019-05-23
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Publication No.: US10558200B2Publication Date: 2020-02-11
- Inventor: Alejandro Manuel de Pena , Sebastia Cortes Herms , Josep Giralt Adroher
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- Main IPC: G05B19/4099
- IPC: G05B19/4099 ; B29C64/386 ; B29C64/40 ; B29C64/00 ; B33Y50/02

Abstract:
In one example, an additive manufacturing system includes a processing system to obtain characteristic data including conditions under which a heat reservoir may be added close to a portion of the object, based on the characteristic data, add sacrificial structure data to the three-dimensional object data for a sacrificial heat reservoir structure close to a portion of the object and not connected to the object, and generate multiple slice images from the three-dimensional object data including the sacrificial structure data.
Public/Granted literature
- US20190278255A1 PROCESSING OBJECT DATA Public/Granted day:2019-09-12
Information query
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