A method of fabricating a component having active cooling with film holes and other exposed holes is provided. The method includes the step of providing a component including at least one aperture disposed on a surface of the component and fluidly connected to at least one fluid flow passage, the at least one aperture comprising a floor extending from the at least one fluid flow passage to the surface of the component, and a ceiling facing the floor. The method further includes the step of applying a thermal barrier coating over at least a portion of a substrate. The method further includes the step of removing a portion of the thermal barrier coating covering the at least one aperture. The method further includes the step of forming with an additive manufacturing method one or both of a sharp-edged hood of the at least one aperture and at least one feature disposed on the floor.