- 专利标题: Hybrid analog-digital pixel implemented in a stacked configuration
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申请号: US15784937申请日: 2017-10-16
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公开(公告)号: US10566360B2公开(公告)日: 2020-02-18
- 发明人: Jeffrey M. Raynor
- 申请人: STMicroelectronics (Research & Development) Limited
- 申请人地址: GB Marlow
- 专利权人: STMicroelectronics (Research & Development) Limited
- 当前专利权人: STMicroelectronics (Research & Development) Limited
- 当前专利权人地址: GB Marlow
- 代理机构: Crowe & Dunlevy
- 主分类号: H01L27/14
- IPC分类号: H01L27/14 ; H01L27/146
摘要:
A hybrid analog-digital pixel circuit is fabricated on two wafers. A first wafer includes the analog pixel circuitry and a second wafer includes the digital control and processing circuitry. Externally accessible contact structures for electrically interconnecting the two wafers are arranged in groups. Each group includes externally accessible contact structures for carrying signals associated solely with operation of a corresponding pixel.
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