Invention Grant
- Patent Title: Cooling assembly
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Application No.: US15935450Application Date: 2018-03-26
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Publication No.: US10571206B2Publication Date: 2020-02-25
- Inventor: David Allen Moore , John P. Franz , Tahir Cader , Michael Lawrence Sabotta
- Applicant: Hewlett Packard Enterprise Development LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Main IPC: G05D23/00
- IPC: G05D23/00 ; F28F13/06 ; H01L23/473 ; H05K7/20

Abstract:
An assembly useable with a cooling system is provided herein. The assembly includes a support member, a channel, and a fluid control mechanism. The support member includes a receiving member formed therein to receive a thermal member. The channel is formed within the support member to carry a fluid therethrough. The fluid control mechanism is along the channel to control the flow of the fluid.
Public/Granted literature
- US20180216899A1 COOLING ASSEMBLY Public/Granted day:2018-08-02
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