公开(公告)号：US10571206B2

公开(公告)日：2020-02-25

申请号：US15935450

申请日：2018-03-26

Applicant: Hewlett Packard Enterprise Development LP

Inventor： David Allen Moore ,  John P. Franz ,  Tahir Cader ,  Michael Lawrence Sabotta

IPC: G05D23/00 ,  F28F13/06 ,  H01L23/473 ,  H05K7/20

Abstract: An assembly useable with a cooling system is provided herein. The assembly includes a support member, a channel, and a fluid control mechanism. The support member includes a receiving member formed therein to receive a thermal member. The channel is formed within the support member to carry a fluid therethrough. The fluid control mechanism is along the channel to control the flow of the fluid.

公开(公告)号：US20180216899A1

公开(公告)日：2018-08-02

申请号：US15935450

申请日：2018-03-26

Applicant: Hewlett Packard Enterprise Development LP

Inventor： David Allen Moore ,  John P. Franz ,  Tahir Cader ,  Michael Lawrence Sabotta

IPC: F28F13/06 ,  H05K7/20 ,  H01L23/473

CPC classification number: F28F13/06 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20781 ,  H05K7/20809 ,  H01L2924/00

Abstract: An assembly useable with a cooling system is provided herein. The assembly includes a support member, a channel, and a fluid control mechanism. The support member includes a receiving member formed therein to receive a thermal member. The channel is formed within the support member to carry a fluid therethrough. The fluid control mechanism is along the channel to control the flow of the fluid.