Invention Grant
- Patent Title: Electronic component and electronic component device
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Application No.: US16119249Application Date: 2018-08-31
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Publication No.: US10573461B2Publication Date: 2020-02-25
- Inventor: Shinya Onodera , Takehisa Tamura , Atsushi Takeda , Ken Morita
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agent Darle M. Short
- Priority: JP2017-173408 20170908
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/248 ; H01G4/30 ; H05K1/02 ; H05K1/11 ; H05K1/18 ; H01G4/12 ; H05K3/34

Abstract:
An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed at an end portion of the element body in the third direction. The external electrode includes a conductive resin layer. The conductive resin layer covers a region near the first principal surface of the end surface. A height of the conductive resin layer in the first direction is larger at an end portion in the second direction than at a center in the second direction, when viewed from the third direction.
Public/Granted literature
- US20190080845A1 ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT DEVICE Public/Granted day:2019-03-14
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