Invention Grant
- Patent Title: Printed wiring board
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Application No.: US15477589Application Date: 2017-04-03
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Publication No.: US10573619B2Publication Date: 2020-02-25
- Inventor: Takashi Akaguma , Takafumi Yasuhara , Naohito Motooka , Satoru Hasegawa , Satoshi Yamagishi , Shinya Muroga , Kazumasa Yasuta
- Applicant: FUJITSU TEN LIMITED , FUJITSU LIMITED
- Applicant Address: JP Kobe-shi JP Kawasaki-shi
- Assignee: FUJITSU TEN LIMITED,FUJITSU LIMITED
- Current Assignee: FUJITSU TEN LIMITED,FUJITSU LIMITED
- Current Assignee Address: JP Kobe-shi JP Kawasaki-shi
- Agency: Oliff PLC
- Priority: JP2016-083902 20160419
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L23/28 ; H01L23/31 ; H01L23/00 ; H01L29/78 ; H01M10/052 ; H01M10/46
Abstract:
A printed wiring board according to an embodiment includes a metal plate and a wiring member. The meal plate includes a current path part, which is a main current path of an electronic part mounted on or above a front surface of the metal plate, and a heat radiation part, which radiates heat generated from the electronic part. The wiring member is arranged on or above a back surface of the metal plate. The current path part and the heat radiation part are in the same layer to be integrally formed with the wiring member.
Public/Granted literature
- US20170301642A1 PRINTED WIRING BOARD Public/Granted day:2017-10-19
Information query
IPC分类:
