Invention Grant
- Patent Title: Fin-type field effect transistor structure and manufacturing method thereof
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Application No.: US15054089Application Date: 2016-02-25
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Publication No.: US10573749B2Publication Date: 2020-02-25
- Inventor: Chun Hsiung Tsai , Ziwei Fang , Shiu-Ko JangJian , Kei-Wei Chen , Huai-Tei Yang , Ying-Lang Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L27/01
- IPC: H01L27/01 ; H01L29/78 ; H01L27/12 ; H01L21/8234 ; H01L29/66 ; H01L29/161 ; H01L29/16 ; H01L29/165

Abstract:
A fin-type field effect transistor comprising a substrate, at least one gate structure, first spacers, second spacers and source and drain regions is described. The substrate has fins and insulators disposed between the fins. The at least one gate structure is disposed over the fins and disposed on the insulators. The first spacers are disposed on opposite sidewalls of the at least one gate structure. The source and drain regions are disposed on two opposite sides of the at least one gate structure and beside the first spacers. The second spacers are disposed on the two opposite sides of the at least one gate structure and beside the first spacers. The source and drain regions are sandwiched between the opposite second spacers.
Public/Granted literature
- US20170250281A1 FIN-TYPE FIELD EFFECT TRANSISTOR STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-08-31
Information query
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