Invention Grant
- Patent Title: Light-emitting semiconductor chip and method for producing a light-emitting semiconductor chip
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Application No.: US16081159Application Date: 2017-03-15
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Publication No.: US10573787B2Publication Date: 2020-02-25
- Inventor: Lutz Höppel
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee Address: DE Regensburg
- Agency: Slater Matsil, LLP
- Priority: DE102016104965 20160317
- International Application: PCT/EP2017/056153 WO 20170315
- International Announcement: WO2017/158046 WO 20170921
- Main IPC: H01L33/46
- IPC: H01L33/46 ; H01L33/40 ; H01L33/20

Abstract:
A light-emitting semiconductor chip and a method for producing a light-emitting semiconductor chip are disclosed. In an embodiment a light-emitting chip includes a semiconductor body having an active region designed to generate light, a dielectric mirror including an electrically insulating material and a first metallic mirror including an electrically conductive material, wherein the semiconductor body expands towards a light exit side, wherein the dielectric mirror is arranged on a side of the semiconductor body facing away from the light exit side, wherein the first metallic mirror is arranged on a side of the dielectric mirror facing away from the semiconductor body, wherein the first metallic mirror electrically contacts the semiconductor body through at least one opening in the dielectric mirror, and wherein the dielectric mirror, apart from the at least one opening, completely covers the semiconductor body on the side facing away from the light exit side.
Public/Granted literature
- US20190019921A1 Light-Emitting Semiconductor Chip and Method for Producing a Light-Emitting Semiconductor Chip Public/Granted day:2019-01-17
Information query
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