A flexible display substrate includes a flexible base substrate, and a plurality of conductive terminals and a stress relief layer which are arranged sequentially on the flexible base substrate and disposed in a bonding region of the flexible base substrate. The bonding region includes Pad regions. The stress relief layer is provided with via holes on positions corresponding to the Pad regions respectively, and the via holes are used for exposing conductive surfaces of the conductive terminals respectively. The conductive surfaces are used for bonding an IC.