公开(公告)号：US10573833B2

公开(公告)日：2020-02-25

申请号：US16176919

申请日：2018-10-31

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Liqiang Chen ,  PaoMing Tsai ,  Jianwei Li ,  Dejun Bu ,  Song Zhang

IPC: H01L51/00 ,  H01L27/32 ,  H01L51/52 ,  G06F3/041 ,  H01L51/56 ,  G02F1/1333 ,  G06F3/044

Abstract: A flexible display substrate includes a flexible base substrate, and a plurality of conductive terminals and a stress relief layer which are arranged sequentially on the flexible base substrate and disposed in a bonding region of the flexible base substrate. The bonding region includes Pad regions. The stress relief layer is provided with via holes on positions corresponding to the Pad regions respectively, and the via holes are used for exposing conductive surfaces of the conductive terminals respectively. The conductive surfaces are used for bonding an IC.

公开(公告)号：US20190148327A1

公开(公告)日：2019-05-16

申请号：US16125063

申请日：2018-09-07

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Liqiang Chen ,  PaoMing Tsai ,  Jianwei Li ,  Dejun Bu ,  Shuang Du ,  Can Zheng

IPC: H01L23/00 ,  H01L27/12

Abstract: The present disclosure provides a driving chip, a display substrate, a display device and a method for manufacturing a display device. The driving chip according to the present disclosure includes a substrate; and a plurality of connecting bumps and a plurality of supporting bumps disposed on the substrate. The plurality of connecting bumps include at least one set of connecting bumps arranged along a first direction, and the plurality of supporting bumps include the supporting bump that is located between the adjacent connecting bumps arranged along the first direction.

公开(公告)号：US10971465B2

公开(公告)日：2021-04-06

申请号：US16125063

申请日：2018-09-07

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Liqiang Chen ,  PaoMing Tsai ,  Jianwei Li ,  Dejun Bu ,  Shuang Du ,  Can Zheng

IPC: H01L23/00 ,  H01L27/12 ,  H01L27/32

Abstract: The present disclosure provides a driving chip, a display substrate, a display device and a method for manufacturing a display device. The driving chip according to the present disclosure includes a substrate; and a plurality of connecting bumps and a plurality of supporting bumps disposed on the substrate. The plurality of connecting bumps include at least one set of connecting bumps arranged along a first direction, and the plurality of supporting bumps include the supporting bump that is located between the adjacent connecting bumps arranged along the first direction.