Invention Grant
- Patent Title: Coil component
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Application No.: US15619974Application Date: 2017-06-12
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Publication No.: US10580559B2Publication Date: 2020-03-03
- Inventor: Sang Jong Lee , Su Bong Jang , Han Kim , Min Ki Jung
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2016-0085997 20160707; KR10-2016-0161452 20161130
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F17/00 ; H01F27/32 ; H01F27/29 ; H03H7/38

Abstract:
A coil component may include a body including a plurality of insulating layers having coil patterns disposed on the plurality of insulating layers. The coil pattern may include a coil portion, a leading portion disposed on one side of the insulating layer, and a connection portion connecting the coil portion and the leading portion, a pattern line of the coil portion may have an arc shape, and the connection portion may be formed in a tangent line direction of the coil portion from one end of the leading portion.
Public/Granted literature
- US20180012700A1 COIL COMPONENT Public/Granted day:2018-01-11
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