Invention Grant
- Patent Title: Display component packaging structure, manufacturing method thereof, and display device
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Application No.: US16320214Application Date: 2018-05-22
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Publication No.: US10581024B2Publication Date: 2020-03-03
- Inventor: Chengyuan Luo
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Brooks Kushman P.C.
- Priority: CN201710379267 20170525
- International Application: PCT/CN2018/087863 WO 20180522
- International Announcement: WO2018/214878 WO 20181129
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/56 ; H01L27/32

Abstract:
A display component packaging structure, a manufacturing method thereof, and a display device are provided. The display component packaging structure includes a base substrate, a display component arranged at a surface of the base substrate, a packaging cover plate covering the display component, and a heat dissipation layer arranged at a surface of the packaging cover plate adjacent to the display component. An orthogonal projection of the heat dissipation layer onto the base substrate at least partially overlaps an orthogonal projection of the display component onto the base substrate.
Public/Granted literature
- US20190267566A1 DISPLAY COMPONENT PACKAGING STRUCTURE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE Public/Granted day:2019-08-29
Information query
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