Invention Grant
- Patent Title: Semiconductor integrated circuit device
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Application No.: US15274473Application Date: 2016-09-23
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Publication No.: US10581414B2Publication Date: 2020-03-03
- Inventor: Chun-Neng Liao , Meng-Hsin Chiang , Chun-Wei Chang , Chee-Kong Ung , Ching-Chih Li
- Applicant: MediaTek Inc.
- Applicant Address: TW Hsin-Chu
- Assignee: MediaTek Inc.
- Current Assignee: MediaTek Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H03K5/1252
- IPC: H03K5/1252 ; H03H7/06 ; H01L25/16 ; H01L23/64 ; H03H3/02

Abstract:
A semiconductor integrated circuit device includes a chip main circuit, a damper and a passive component. The chip main circuit is coupled to a power source and performs a predetermined function. The damper is coupled to an output terminal of the chip main circuit. The passive component is coupled to the chip main circuit via the damper.
Public/Granted literature
- US20170111032A1 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE Public/Granted day:2017-04-20
Information query
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