公开(公告)号：US10581414B2

公开(公告)日：2020-03-03

申请号：US15274473

申请日：2016-09-23

Applicant: MediaTek Inc.

Inventor： Chun-Neng Liao ,  Meng-Hsin Chiang ,  Chun-Wei Chang ,  Chee-Kong Ung ,  Ching-Chih Li

IPC: H03K5/1252 ,  H03H7/06 ,  H01L25/16 ,  H01L23/64 ,  H03H3/02

Abstract: A semiconductor integrated circuit device includes a chip main circuit, a damper and a passive component. The chip main circuit is coupled to a power source and performs a predetermined function. The damper is coupled to an output terminal of the chip main circuit. The passive component is coupled to the chip main circuit via the damper.