A method of providing cooling structure for a component including forming a first cavity in the component and forming a first passageway in the first cavity in fluid communication with a second cavity positioned inside the component, the second cavity in fluid communication with a cooling air source. The method includes forming a unitary insert including a first surface, a second surface, the insert having an inlet formed in the first surface and an outlet formed in the second surface. A second passageway is in fluid communication with the inlet and the outlet. The method includes positioning the insert in the first cavity into fluid communication with the first passageway, the first surface facing the first cavity; and rigidly attaching the insert in the first cavity.