Invention Grant
- Patent Title: Scanning probe inspector
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Application No.: US16130699Application Date: 2018-09-13
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Publication No.: US10585115B2Publication Date: 2020-03-10
- Inventor: Duck Mahn Oh , Sung Yoon Ryu , Young Hoon Sohn , Chung Sam Jun , Yun Jung Jee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2017-0166486 20171206
- Main IPC: G01Q60/00
- IPC: G01Q60/00 ; G01Q60/16 ; G01Q80/00 ; G02B21/00

Abstract:
A scanning probe inspector comprises: a probe that includes a cantilever and a tip whose length corresponds to a depth of a trench that is formed in a wafer; a trench detector that acquires location information of the trench using the probe, where the location information includes depth information of the trench; a controller that inserts the tip into a first point where there exists a trench based on the location information of the trench, and moves the tip through the trench using the location information of the trench; and a defect detector that detects a presence of a defect in a sidewall of the trench as the tip is moved through the trench.
Public/Granted literature
- US20190170788A1 SCANNING PROBE INSPECTOR Public/Granted day:2019-06-06
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