Systems and methods for selecting die and package parasitic for an input-output (IO) power domain are described. In one embodiment, the method includes determining a minimum on-die decoupling capacitance based at least in part on a product of a number of simultaneously switching IOs of the die and a maximum instantaneous current of an IO; determining a maximum package inductance based at least in part on a maximum operating frequency of an IC and a target impedance of a power delivery network of the die, the IC package, and a printed circuit board (PCB); and determining a maximum die resistance based at least in part on preventing the maximum die resistance from exceeding a maximum static IR drop of the die.