Invention Grant
- Patent Title: Selective deposition of metal silicides
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Application No.: US16189429Application Date: 2018-11-13
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Publication No.: US10586707B2Publication Date: 2020-03-10
- Inventor: Raymond Hung , Namsung Kim , Srinivas D. Nemani , Ellie Y. Yieh , Jong Choi , Christopher Ahles , Andrew Kummel
- Applicant: Applied Materials, Inc. , The Regents of the University of California
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L21/285
- IPC: H01L21/285 ; H01L21/311 ; H01L21/324 ; C23C16/46 ; C23C16/42 ; C23C16/455 ; C23C16/04 ; C23C16/08 ; C23C16/02

Abstract:
Embodiments of the disclosure relate to selective metal silicide deposition methods. In one embodiment, a substrate having a silicon containing surface is heated and the silicon containing surface is hydrogen terminated. The substrate is exposed to sequential cycles of a MoF6 precursor and a Si2H6 precursor which is followed by an additional Si2H6 overdose exposure to selectively deposit a MoSix material comprising MoSi2 on the silicon containing surface of the substrate. Methods described herein also provide for selective native oxide removal which enables removal of native oxide material without etching bulk oxide materials.
Public/Granted literature
- US20190103278A1 SELECTIVE DEPOSITION OF METAL SILICIDES Public/Granted day:2019-04-04
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