发明授权
- 专利标题: Suction stage, lamination device, and method for manufacturing laminated substrate
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申请号: US15021516申请日: 2014-09-24
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公开(公告)号: US10586727B2公开(公告)日: 2020-03-10
- 发明人: Emi Matsui , Konosuke Hayashi , Takahiro Kanai
- 申请人: Shibaura Mechatronics Corporation
- 申请人地址: JP Yokohama-shi, Kanagawa-ken
- 专利权人: Shibaura Mechatronics Corporation
- 当前专利权人: Shibaura Mechatronics Corporation
- 当前专利权人地址: JP Yokohama-shi, Kanagawa-ken
- 代理商 Chunhsi Andy Mu
- 优先权: JP2013-198584 20130925
- 国际申请: PCT/JP2014/075274 WO 20140924
- 国际公布: WO2015/046243 WO 20150402
- 主分类号: H01L21/683
- IPC分类号: H01L21/683 ; H01L21/67 ; H01L21/687 ; B32B37/10 ; B32B37/14
摘要:
A suction stage may include a mounting section configured to mount a first substrate, and an evacuation section configured to evacuate air between the first substrate and the mounting section. The mounting section includes a ring-shaped first wall part, and a ring-shaped second wall part inside the first wall part. The evacuation section includes a first control valve between the evacuation section and a first region between the first and second wall parts, a second control valve between the evacuation section and a second region inside the second wall part, and a control section configured to control the valves. The control section is configured to control the valves so that suction and non-suction of the first substrate are alternately performed in at least one of the regions. Thus, suction of the first substrate may be deactivated in one of the regions, while the suction is active in the other region.
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