Invention Grant
- Patent Title: Suction stage, lamination device, and method for manufacturing laminated substrate
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Application No.: US15021516Application Date: 2014-09-24
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Publication No.: US10586727B2Publication Date: 2020-03-10
- Inventor: Emi Matsui , Konosuke Hayashi , Takahiro Kanai
- Applicant: Shibaura Mechatronics Corporation
- Applicant Address: JP Yokohama-shi, Kanagawa-ken
- Assignee: Shibaura Mechatronics Corporation
- Current Assignee: Shibaura Mechatronics Corporation
- Current Assignee Address: JP Yokohama-shi, Kanagawa-ken
- Agent Chunhsi Andy Mu
- Priority: JP2013-198584 20130925
- International Application: PCT/JP2014/075274 WO 20140924
- International Announcement: WO2015/046243 WO 20150402
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67 ; H01L21/687 ; B32B37/10 ; B32B37/14

Abstract:
A suction stage may include a mounting section configured to mount a first substrate, and an evacuation section configured to evacuate air between the first substrate and the mounting section. The mounting section includes a ring-shaped first wall part, and a ring-shaped second wall part inside the first wall part. The evacuation section includes a first control valve between the evacuation section and a first region between the first and second wall parts, a second control valve between the evacuation section and a second region inside the second wall part, and a control section configured to control the valves. The control section is configured to control the valves so that suction and non-suction of the first substrate are alternately performed in at least one of the regions. Thus, suction of the first substrate may be deactivated in one of the regions, while the suction is active in the other region.
Public/Granted literature
- US20160225655A1 SUCTION STAGE, LAMINATION DEVICE, AND METHOD FOR MANUFACTURING LAMINATED SUBSTRATE Public/Granted day:2016-08-04
Information query
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