Invention Grant
- Patent Title: Semiconductor device including an integrated resistor
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Application No.: US16236741Application Date: 2018-12-31
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Publication No.: US10586792B2Publication Date: 2020-03-10
- Inventor: Dirk Ahlers , Markus Zundel , Peter Brandl , Kurt Matoy , Thomas Ostermann
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102016120292 20161025
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L29/78 ; H01L29/06 ; H01L29/786 ; H01L29/40 ; H01L49/02 ; H01L29/739 ; H01L29/808

Abstract:
A semiconductor device of an embodiment includes a transistor device in a semiconductor die including a semiconductor body. The transistor device includes transistor cells connected in parallel and covering at least 80% of an overall active area at a first surface of the semiconductor body. The semiconductor device further includes a control terminal contact area at the first surface electrically connected to a control electrode of each of the transistor cells. A first load terminal contact area at the first surface electrically connected to a first load terminal region of each of the transistor cells. The semiconductor device further includes a resistor in the semiconductor die and electrically coupled between the control terminal contact area and the first load terminal contact area.
Public/Granted literature
- US20190157259A1 Semiconductor Device Including an Integrated Resistor Public/Granted day:2019-05-23
Information query
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