Invention Grant
- Patent Title: Semiconductor assembly
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Application No.: US16073008Application Date: 2016-01-26
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Publication No.: US10588234B2Publication Date: 2020-03-10
- Inventor: Kevin B. Leigh , George D. Megason
- Applicant: Hewlett Packard Enterprise Development LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Department
- International Application: PCT/US2016/014927 WO 20160126
- International Announcement: WO2017/131638 WO 20170803
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H05K7/10 ; H05K7/20 ; H01L23/32 ; H01R12/71
Abstract:
An example semiconductor assembly can include a hingeably-coupled component that receives a semiconductor board. In some examples, the component can be hingeably rotated to an open position to receive the semiconductor board. In some examples, the component can be hingeably detached from the assembly to receive the semiconductor board.
Public/Granted literature
- US20190045650A1 SEMICONDUCTOR ASSEMBLY Public/Granted day:2019-02-07
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