Invention Grant
- Patent Title: Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board
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Application No.: US14898857Application Date: 2014-06-13
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Publication No.: US10590223B2Publication Date: 2020-03-17
- Inventor: Yuki Kitai , Hiroaki Fujiwara , Hirosuke Saito
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2013-127464 20130618
- International Application: PCT/JP2014/003177 WO 20140613
- International Announcement: WO2014/203511 WO 20141224
- Main IPC: C08F290/06
- IPC: C08F290/06 ; C08J5/24 ; B32B15/14 ; C08F279/02 ; C08G65/48 ; C08K5/01 ; C08L9/00 ; C08L71/12 ; H05K1/03 ; B32B5/02 ; C08K5/03 ; C08L51/08

Abstract:
A polyphenylene ether resin composition includes (A) a modified polyphenylene ether that is end-modified with a substituent having a carbon-carbon unsaturated double bond, and (B) a crosslinking agent having a carbon-carbon unsaturated double bond. The crosslinking agent serving as component (B) includes from 50 to 100 mass % of (B-1) divinylbenzene and (B-2) polybutadiene. Components (A) and (B) are included in a ratio therebetween, expressed as the mass ratio (A):(B), of from 65:35 to 95:5. Components (B-1) and (B-2) are included in a ratio therebetween, expressed as the mass ratio (B-1):(B-2), of from 1:100 to 1.5:1.
Public/Granted literature
- US20160145370A1 POLYPHENYLENE ETHER RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE AND PRINTED WIRING BOARD Public/Granted day:2016-05-26
Information query
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