Invention Grant
- Patent Title: Multisiphon passive cooling system
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Application No.: US15876438Application Date: 2018-01-22
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Publication No.: US10590916B2Publication Date: 2020-03-17
- Inventor: Alistair Martin Waddell , Mark Aaron Chan , Mikel Andonegi Aldaz
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Dority & Manning, P.A.
- Main IPC: F03D80/60
- IPC: F03D80/60 ; F03D9/25 ; F25B41/00

Abstract:
A cooling system includes one or more heat generating components located within an enclosure. A first conduit is thermally connected to one or more of the heat generating components, and the first conduit is fluidly connected to a distribution manifold and a condensing unit. The condensing unit is located external to the enclosure and above the heat generating components. The distribuition manifold is located below the heat generating components. A second conduit is fluidly connected to the condensing unit and the distribution manifold. The cooling system includes a two-phase cooling medium. The first conduit, condensing unit, second conduit and distribution manifold form a loop in which the cooling medium circulates.
Public/Granted literature
- US20190226461A1 MULTISIPHON PASSIVE COOLING SYSTEM Public/Granted day:2019-07-25
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