公开(公告)号：US10590916B2

公开(公告)日：2020-03-17

申请号：US15876438

申请日：2018-01-22

Applicant: General Electric Company

Inventor： Alistair Martin Waddell ,  Mark Aaron Chan ,  Mikel Andonegi Aldaz

IPC: F03D80/60 ,  F03D9/25 ,  F25B41/00

Abstract: A cooling system includes one or more heat generating components located within an enclosure. A first conduit is thermally connected to one or more of the heat generating components, and the first conduit is fluidly connected to a distribution manifold and a condensing unit. The condensing unit is located external to the enclosure and above the heat generating components. The distribuition manifold is located below the heat generating components. A second conduit is fluidly connected to the condensing unit and the distribution manifold. The cooling system includes a two-phase cooling medium. The first conduit, condensing unit, second conduit and distribution manifold form a loop in which the cooling medium circulates.

公开(公告)号：US20190226461A1

公开(公告)日：2019-07-25

申请号：US15876438

申请日：2018-01-22

Applicant: General Electric Company

Inventor： Alistair Martin Waddell ,  Mark Aaron Chan ,  Mikel Andonegi Aldaz

IPC: F03D80/60 ,  F03D9/25 ,  F25B41/00

Abstract: A cooling system includes one or more heat generating components located within an enclosure. A first conduit is thermally connected to one or more of the heat generating components, and the first conduit is fluidly connected to a distribution manifold and a condensing unit. The condensing unit is located external to the enclosure and above the heat generating components. The distribuition manifold is located below the heat generating components. A second conduit is fluidly connected to the condensing unit and the distribution manifold. The cooling system includes a two-phase cooling medium. The first conduit, condensing unit, second conduit and distribution manifold form a loop in which the cooling medium circulates.