Invention Grant
- Patent Title: Method and apparatus for integrated circuit monitoring and prevention of electromigration failure
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Application No.: US15177964Application Date: 2016-06-09
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Publication No.: US10591531B2Publication Date: 2020-03-17
- Inventor: Rajit Chandra , Melika Roshandell , Niladri Mojumder
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: Qualcomm Incorporated
- Current Assignee: Qualcomm Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Arent Fox, LLP
- Main IPC: G01R31/28
- IPC: G01R31/28

Abstract:
An apparatus is disclosed. The apparatus includes a circuit, a conductor interconnecting a portion of the circuit, and a processor configured to determine a temperature of the conductor and adjust at least one parameter related to the conductor in response to the determined temperature rising above a threshold. The at least one parameter includes a lifetime estimate for the conductor. A method of operating an apparatus including a circuit and a conductor interconnecting a portion of the circuit is disclosed. The method includes determining a temperature of the conductor, and adjusting at least one parameter related to the conductor in response to the determined temperature rising above a threshold. The parameter includes a lifetime estimate for the conductor.
Public/Granted literature
- US20160363623A1 METHOD AND APPARATUS FOR INTEGRATED CIRCUIT MONITORING AND PREVENTION OF ELECTROMIGRATION FAILURE Public/Granted day:2016-12-15
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