Various embodiments of an integrated device package with integrated antennas are disclosed. In some embodiments, an antenna can be defined along a die pad of the package. In some embodiments, an antenna can be disposed in a first packaging component, and an integrated device die can be disposed in a second packaging component. The first and second packaging components can be stacked on one another and electrically connected. In some embodiments, a package can include one or a plurality of antennas disposed along a wall of a package body. The plurality of antennas can be disposed facing different directions from the package.