公开(公告)号：US10593634B2

公开(公告)日：2020-03-17

申请号：US15396107

申请日：2016-12-30

Applicant: Analog Devices, Inc.

Inventor： Youn-Jae Kook ,  Yeonsung Kim ,  Dipak Sengupta

IPC: H01L23/66 ,  H01Q1/22 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L23/552 ,  H01L25/10 ,  H01L23/04

Abstract: Various embodiments of an integrated device package with integrated antennas are disclosed. In some embodiments, an antenna can be defined along a die pad of the package. In some embodiments, an antenna can be disposed in a first packaging component, and an integrated device die can be disposed in a second packaging component. The first and second packaging components can be stacked on one another and electrically connected. In some embodiments, a package can include one or a plurality of antennas disposed along a wall of a package body. The plurality of antennas can be disposed facing different directions from the package.

公开(公告)号：US11702335B2

公开(公告)日：2023-07-18

申请号：US17112894

申请日：2020-12-04

Applicant: Analog Devices, Inc.

Inventor： Yeonsung Kim ,  Shafi Saiyed ,  Thomas M. Goida

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81B7/0048 ,  B81C1/0023 ,  B81B2207/015

Abstract: An integrated device package is disclosed. The integrated device package can include a package housing that defines a cavity. The integrated device package can include an integrated device die that is disposed in the cavity. The integrated device die has a first surface includes a sensitive component. A second surface is free from a die attach material. The second surface is opposite the first surface. The integrated device die include a die cap that is bonded to the first surface. The integrated device package can also include a supporting structure that attaches the die cap to the package housing.

公开(公告)号：US20220177298A1

公开(公告)日：2022-06-09

申请号：US17112894

申请日：2020-12-04

Applicant: Analog Devices, Inc.

Inventor： Yeonsung Kim ,  Shafi Saiyed ,  Thomas M. Goida

IPC: B81B7/00 ,  B81C1/00

Abstract: An integrated device package is disclosed. The integrated device package can include a package housing that defines a cavity. The integrated device package can include an integrated device die that is disposed in the cavity. The integrated device die has a first surface includes a sensitive component. A second surface is free from a die attach material. The second surface is opposite the first surface. The integrated device die include a die cap that is bonded to the first surface. The integrated device package can also include a supporting structure that attaches the die cap to the package housing.

公开(公告)号：US20180190600A1

公开(公告)日：2018-07-05

申请号：US15396107

申请日：2016-12-30

Applicant: Analog Devices, Inc.

Inventor： Youn-Jae Kook ,  Yeonsung Kim ,  Dipak Sengupta

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L23/66 ,  H01L23/04 ,  H01L23/3107 ,  H01L23/49534 ,  H01L23/49555 ,  H01L23/49827 ,  H01L23/552 ,  H01L25/105 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2924/15192 ,  H01L2924/181 ,  H01Q1/2283 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Various embodiments of an integrated device package with integrated antennas are disclosed. In some embodiments, an antenna can be defined along a die pad of the package. In some embodiments, an antenna can be disposed in a first packaging component, and an integrated device die can be disposed in a second packaging component. The first and second packaging components can be stacked on one another and electrically connected. In some embodiments, a package can include one or a plurality of antennas disposed along a wall of a package body. The plurality of antennas can be disposed facing different directions from the package.