Invention Grant
- Patent Title: Apparatus for assembling devices
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Application No.: US15222958Application Date: 2016-07-29
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Publication No.: US10593644B2Publication Date: 2020-03-17
- Inventor: Chin-Hung Wang , Yu-Wei Huang
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H01L23/00 ; H05K3/34

Abstract:
An apparatus for assembling devices, comprising a plurality of actuated devices disposed on a substrate, each of the actuated devices comprising a first electrode disposed on and electrically connect to the substrate, a connecting pad disposed on the substrate, an electro-active polymer layer comprising a first surface disposed on the connecting pad and a second surface, and a second electrode disposed on the second surface of the electro-active polymer layer and electrically connected to the substrate.
Public/Granted literature
- US20180035550A1 APPARATUS FOR ASSEMBLING DEVICES Public/Granted day:2018-02-01
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