Invention Grant
- Patent Title: Systems and methods for flash stacking
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Application No.: US16368219Application Date: 2019-03-28
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Publication No.: US10593651B2Publication Date: 2020-03-17
- Inventor: Belgacem Haba , Ilyas Mohammed , Javier A. Delacruz
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L25/065 ; H01L23/00 ; H01L25/00 ; H01L21/78
Abstract:
A three-dimensional stacking technique performed in a wafer-to-wafer fashion reducing the machine movement in production. The Wafers are processed with metallic traces and stacked before dicing into separate die stacks. The traces of each layer of the stacks are interconnected via electroless plating.
Public/Granted literature
- US20190371765A1 SYSTEMS AND METHODS FOR FLASH STACKING Public/Granted day:2019-12-05
Information query
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