A method for manufacturing a device comprising an inorganic/organic hybrid perovskite compound film, according to the present invention, comprises the steps of: a) laminating a first structure and a second structure to allow the first surface layer and the second surface layer to be in contact with each other, the first structure comprising a first surface layer containing at least one of materials i) to v) below, the second structure comprising a second surface layer containing, independently from the first surface layer, at least one of materials i) to v) below; and b) applying heat and physical force to the laminate in which the first structure and the second structure are laminated: i) an inorganic/organic hybrid perovskite compound, ii) an organic halide, iii) a metal halide, iv) an inorganic/organic hybrid perovskite compound precursor, and v) a metal halide precursor.