Processes and formulations for manufacturing a painted circuit are disclosed. In some implementations, a painted circuit can be manufactured using a process including providing a substrate and applying one or more paint layers on a surface of the substrate, where the one or more paint layers each form an electrical component of the painted circuit. A given paint layer of the one or more paint layers can include a conductive paint formulation having a resistance that is defined by a concentration of conductive material that is included in the conductive paint formulation and a thickness of the given paint layer, and lower concentrations of the conductive material included in the conductive paint formulation provide a higher resistance than higher concentrations of conductive material.