Invention Grant
- Patent Title: Coil component
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Application No.: US15865484Application Date: 2018-01-09
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Publication No.: US10600550B2Publication Date: 2020-03-24
- Inventor: Hwan Soo Lee , Yoon Hee Cho , Sung Min Song
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2017-0104806 20170818
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/255 ; H01F27/29 ; H01F17/00 ; H01F41/02 ; B22F1/00 ; C22C45/02 ; C22C33/02 ; B32B15/01 ; C22C38/00 ; H01F17/04 ; H01F1/153

Abstract:
A coil component includes a body having a volume of 2.4 mm3 or less and including at least one coil member embedded therein, and first and second external electrodes partially or entirely formed on first and second surfaces of the body opposing each other, respectively, wherein the product of inductance Ls (μH) and S/l (mm) is 0.45 (μH·mm) or more to 0.75 (μH·mm) or less in which S (mm2) is an area of regions of the first and second external electrodes disposed on the first and second surfaces of the body, and 1 (mm) is a minimum spaced distance between the first and second external electrodes formed on the first and second surfaces of the body.
Public/Granted literature
- US20190057801A1 COIL COMPONENT Public/Granted day:2019-02-21
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