公开(公告)号：US11881345B2

公开(公告)日：2024-01-23

申请号：US16402520

申请日：2019-05-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Gun Woo Koo ,  Sung Min Song ,  Hwan Soo Lee ,  Hwi Dae Kim

IPC: H01F5/00 ,  H01F27/29 ,  H01F27/28 ,  H01F41/12 ,  H01F41/04 ,  H01F27/32

CPC classification number: H01F27/29 ,  H01F27/2804 ,  H01F27/323 ,  H01F41/041 ,  H01F41/122 ,  H01F2027/2809

Abstract: A coil component includes a body, an internal insulating layer disposed in the body, and a coil portion disposed on the internal insulating layer. The coil portion includes first and second coil patterns disposed on opposing surfaces of the internal insulating layer, respectively, first main and first auxiliary lead-out portions extending from the first coil pattern and respectively exposed to a front surface and one side surface of the body connected to each other, and second main and second auxiliary lead-out portions extending from the second coil pattern and respectively exposed to a rear surface and another side surface of the body connected to each other.

公开(公告)号：US11056272B2

公开(公告)日：2021-07-06

申请号：US16114944

申请日：2018-08-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Min Song ,  Yoon Hee Cho ,  Hwan Soo Lee

IPC: H01F27/29 ,  H01F27/28 ,  H01F17/00 ,  H01F27/32 ,  H01F17/04

Abstract: An inductor includes first and second external electrodes spaced apart from each other, a substrate disposed between the first and second external electrodes and having a first surface and a second surface opposing each other, and a conductive structure electrically connected to the first and second external electrodes. The conductive structure includes a first conductive pattern disposed on the first surface of the substrate, a second conductive pattern disposed on the second surface of the substrate, and at least one reinforcing portion. The first conductive pattern has a first side facing the first external electrode, the second conductive pattern has a second side facing the second external electrode, and the at least one reinforcing portion is electrically connected to at least one of the first and second sides and is interposed between the substrate and at least one of the first and second external electrodes.

公开(公告)号：US09929195B2

公开(公告)日：2018-03-27

申请号：US15095419

申请日：2016-04-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kang Hyun Lee ,  Sung Min Song ,  Jung Gon Choi ,  Heung Woo Park ,  Jae Hyun Lim

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L27/14683

Abstract: An image sensor assembly, a method of manufacturing the same, and a camera module are provided. The image sensor assembly includes an image sensor including a pixel region provided on a surface of the image sensor, a cover disposed above the pixel region, a spacer disposed on a surface of the cover and the spacer being configured to maintain a distance between the image sensor and the cover, and an adhesive configured to fixedly attach the spacer to the image sensor, wherein the spacer comprises a first and a second member disposed parallel to and at a distance from each other.

公开(公告)号：US20150187726A1

公开(公告)日：2015-07-02

申请号：US14582196

申请日：2014-12-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Keun PARK ,  Jun Woo Myung ,  Sung Min Song

IPC: H01L23/00 ,  H01L23/495

CPC classification number: H01L23/495 ,  H01L23/3121 ,  H01L23/49531 ,  H01L23/49894 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/37147 ,  H01L2224/3716 ,  H01L2224/40137 ,  H01L2224/40227 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/49 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/13034 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00012

Abstract: There are provided a semiconductor package and a method for manufacturing the same. The semiconductor package according to an exemplary embodiment of the present disclosure includes: a board on which an insulating layer and a plurality of circuit patterns are formed; first bonding parts formed on portions of an upper portion of the circuit pattern; second bonding parts formed on portions of the upper portion of the circuit pattern; a first semiconductor device mounted on the board; a first connecting member of electrically connecting the first bonding part and the first semiconductor device to each other; a second connecting member having one surface bonded to the second bonding part and the other end exposed to the outside; and an oxide film formed on the remaining portions except for the first bonding part and the second bonding part.

Abstract translation: 提供半导体封装及其制造方法。 根据本公开的示例性实施例的半导体封装包括：其上形成有绝缘层和多个电路图案的板; 形成在电路图案的上部的部分上的第一接合部; 形成在电路图案的上部的部分上的第二接合部; 安装在所述板上的第一半导体器件; 将第一接合部和第一半导体器件电连接的第一连接部件; 第二连接构件，其一个表面粘合到第二接合部分，另一端暴露于外部; 以及形成在除了第一接合部和第二接合部之外的其余部分上的氧化膜。

公开(公告)号：US20150187684A1

公开(公告)日：2015-07-02

申请号：US14501577

申请日：2014-09-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jun Woo MYUNG ,  Sung Min Song

IPC: H01L23/495 ,  H01L23/31

CPC classification number: H01L23/3107 ,  H01L23/49517 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/131 ,  H01L2224/16245 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/292 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/2939 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/48111 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/1203 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1815 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: There is provided a semiconductor package capable of preventing a lead frame from being separated from a molded portion during a manufacturing process. The semiconductor package according to an exemplary embodiment in the present disclosure includes: at least one electronic device; a lead frame including a plurality of leads electrically connected to the electronic device; a lead connecting member coupled to at least one of the leads; and a molded portion sealing the electronic device and the lead connecting member.

Abstract translation: 提供一种半导体封装，其能够防止引线框架在制造过程中与模制部分分离。 根据本公开的示例性实施例的半导体封装包括：至少一个电子设备; 引线框架，包括电连接到所述电子设备的多个引线; 引线连接构件，其耦合到所述引线中的至少一个; 以及密封电子设备和引线连接构件的模制部分。

公开(公告)号：US20150146382A1

公开(公告)日：2015-05-28

申请号：US14332164

申请日：2014-07-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Bum Sik Jang ,  Sung Min Song

IPC: H05K7/02 ,  H05K1/09 ,  H05K3/10

CPC classification number: H05K1/09 ,  H01L21/561 ,  H01L23/13 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/49503 ,  H01L23/49531 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/181 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: Disclosed herein are a package substrate, a method of manufacturing the same, and a power module package using the package substrate. The package substrate includes a substrate including an electronic device adhesive portion formed on one surface thereof and a protrusion portion formed on one side surface of the electronic device adhesive portion, an insulating layer formed on one surface of the substrate, and a circuit pattern formed on the insulating layer, wherein the protrusion portion includes an upper surface portion as a connection member adhesive portion, and a first side surface portion and a second side surface portion that are

Abstract translation: 这里公开了封装基板，其制造方法以及使用封装基板的功率模块封装。 封装基板包括基板，该基板包括形成在其一个表面上的电子器件粘合部分和形成在电子器件粘合部分的一个侧表面上的突起部分，形成在基板的一个表面上的绝缘层，以及形成在 绝缘层，其中突出部分包括作为连接构件粘合部分的上表面部分，以及第一侧表面部分和第二侧表面部分，

公开(公告)号：US11424058B2

公开(公告)日：2022-08-23

申请号：US16031639

申请日：2018-07-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hwan Soo Lee ,  Yoon Hee Cho ,  Sung Min Song

IPC: H01F17/00 ,  H01F1/14 ,  H01F17/04 ,  H01F27/29 ,  H01F41/02 ,  H01F27/255 ,  H01F27/30 ,  H01F27/32

Abstract: A coil component includes a support member, an internal coil supported by the support member and including a plurality of coil patterns, and external electrodes connected to the internal coil and including a first layer in contact with the internal coil and a second layer disposed on the first layer. The second layer is a composite layer including a conductive material and a resin. The support member includes first and second surfaces facing the external electrodes, respectively, and one or more of at least a portion of the first surface and at least a portion of the second surface are configured as cut surfaces.

公开(公告)号：US10600550B2

公开(公告)日：2020-03-24

申请号：US15865484

申请日：2018-01-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hwan Soo Lee ,  Yoon Hee Cho ,  Sung Min Song

IPC: H01F5/00 ,  H01F27/255 ,  H01F27/29 ,  H01F17/00 ,  H01F41/02 ,  B22F1/00 ,  C22C45/02 ,  C22C33/02 ,  B32B15/01 ,  C22C38/00 ,  H01F17/04 ,  H01F1/153

Abstract: A coil component includes a body having a volume of 2.4 mm3 or less and including at least one coil member embedded therein, and first and second external electrodes partially or entirely formed on first and second surfaces of the body opposing each other, respectively, wherein the product of inductance Ls (μH) and S/l (mm) is 0.45 (μH·mm) or more to 0.75 (μH·mm) or less in which S (mm2) is an area of regions of the first and second external electrodes disposed on the first and second surfaces of the body, and 1 (mm) is a minimum spaced distance between the first and second external electrodes formed on the first and second surfaces of the body.

公开(公告)号：US20200066439A1

公开(公告)日：2020-02-27

申请号：US16356295

申请日：2019-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Gun Woo Koo ,  Sung Min Song ,  Hwan Soo Lee

IPC: H01F27/36 ,  H01F27/28 ,  H01F27/29 ,  H01F27/32

Abstract: An inductor includes a body including a substrate, a coil portion, including a top coil and a bottom coil disposed on one surface and the other surface of the substrate, respectively, and an encapsulation portion encapsulating the substrate and the coil portion, a first terminal electrode, disposed on a bottom surface of the body and connected to the top coil, and a second terminal electrode disposed on the bottom surface of the body and connected to the bottom coil, a third terminal electrode disposed between the first and second terminal electrodes and disposed on the bottom surface of the body, and a shielding layer disposed to cover the body. The shielding layer is connected to the third terminal electrode.

公开(公告)号：US11495395B2

公开(公告)日：2022-11-08

申请号：US16179575

申请日：2018-11-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Min Song ,  Hwan Soo Lee ,  Yoon Hee Cho ,  Yong Choon Park

IPC: H01F5/00 ,  H01F27/29 ,  H01F17/00 ,  H01F27/32 ,  H01F27/28 ,  H01F41/04 ,  H01F41/12

Abstract: An inductor includes a body including a support member including a through-hole, an internal coil disposed on the support member, and an encapsulant encapsulating the support member and the internal coil; and an external electrode disposed on an external surface of the body and connected to the internal coil. The external electrode includes a conductive resin layer and a double conductive layer of a first conductive layer and a second conductive layer, disposed between the conductive resin layer and the internal coil.