Invention Grant
- Patent Title: Methods of forming staircase structures
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Application No.: US16164542Application Date: 2018-10-18
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Publication No.: US10600681B2Publication Date: 2020-03-24
- Inventor: Lance Williamson , Adam L. Olson , Kaveri Jain , Robert Dembi , William R. Brown
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L23/528 ; H01L21/768 ; H01L27/11582 ; H01L27/11575 ; H01L27/1157 ; H01L27/11556
Abstract:
Methods of forming staircase structures. The method comprises forming a patterned hardmask over tiers. An exposed portion of an uppermost tier is removed to form an uppermost stair. A first liner material is formed over the patterned hardmask and the uppermost tier, and a portion of the first liner material is removed to form a first liner and expose an underlying tier. An exposed portion of the underlying tier is removed to form an underlying stair in the underlying tier. A second liner material is formed over the patterned hardmask, the first liner, and the second liner. A portion of the second liner material is removed to form a second liner and expose another underlying tier. An exposed portion of the another underlying tier is removed to form another underlying stair. The patterned hardmask is removed. Staircase structures and semiconductor device structure are also disclosed.
Public/Granted literature
- US20190206726A1 METHODS OF FORMING STAIRCASE STRUCTURES Public/Granted day:2019-07-04
Information query
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