Invention Grant
- Patent Title: Leadframe with vertically spaced die attach pads
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Application No.: US15151177Application Date: 2016-05-10
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Publication No.: US10600724B2Publication Date: 2020-03-24
- Inventor: Chia-Yu Chang , Chih-Chien Ho , Steven Su
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Ronald O. Neerings; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; G06F17/50 ; H01L23/00 ; H01L23/31
Abstract:
A leadframe includes a first die attach pad (“DAP”) having a first longitudinally extending edge surface and a second DAP having a first longitudinally extending edge surface. The second DAP is positioned with the first longitudinally extending edge surface thereof in adjacent, laterally and vertically spaced relationship with the first longitudinally extending edge surface of the first DAP.
Public/Granted literature
- US20170330822A1 LEADFRAME WITH VERTICALLY SPACED DIE ATTACH PADS Public/Granted day:2017-11-16
Information query
IPC分类:
