Invention Grant
- Patent Title: Electronic component
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Application No.: US15949212Application Date: 2018-04-10
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Publication No.: US10600769B2Publication Date: 2020-03-24
- Inventor: Heng-Chih Lin , Chien-Kuang Lee
- Applicant: Airoha Technology Corp.
- Applicant Address: TW Hsinchu
- Assignee: AIROHA TECHNOLOGY GROUP
- Current Assignee: AIROHA TECHNOLOGY GROUP
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/18 ; H01L25/065 ; H01L23/498
Abstract:
An electronic component is provided. The electronic component includes a substrate, an III-V die and a silicon die. The III-V die is disposed on the substrate. The silicon die is stacked to the III-V and electrically connected to the III-V die.
Public/Granted literature
- US20190074269A1 ELECTRONIC COMPONENT Public/Granted day:2019-03-07
Information query
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