Invention Grant
- Patent Title: Electronic module and method of manufacturing the same
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Application No.: US15991628Application Date: 2018-05-29
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Publication No.: US10602036B2Publication Date: 2020-03-24
- Inventor: Heung Woo Park , Jung Gon Choi
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2015-0065132 20150511; KR10-2015-0107472 20150729
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H01L27/146 ; H01L31/0203
Abstract:
An electronic module includes a mounting surface, a cover disposed above the mounting surface, wherein the cover includes a protruding portion extending from a lower surface of the cover to a predetermined distance, and an adhesion part adhering the protruding portion to the mounting surface.
Public/Granted literature
- US20180278815A1 ELECTRONIC MODULE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-09-27
Information query
