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    Microphone package and mounting structure thereof
    2.
    发明授权
    Microphone package and mounting structure thereof 有权
    麦克风包装及其安装结构

    公开(公告)号：US09120668B2

    公开(公告)日：2015-09-01

    申请号：US14268536

    申请日：2014-05-02

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Heung Woo Park ,  Jong Woo Han ,  Tae Hyun Kim

    IPC: B81B3/00 ,  B81B7/00 ,  B81B7/02

    CPC classification number: B81B7/0077 ,  B81B7/0061 ,  B81B2201/0257

    Abstract: There are provided a microphone package and a mounting structure thereof, allowing for an increase in a back volume, the microphone package including: a package substrate; an acoustic element mounted on the package substrate and having a space formed in a lower portion thereof; and at least one electronic component mounted on the package substrate and having a space formed in a lower portion thereof, wherein the package substrate includes an acoustic volume connecting the space of the acoustic element and the space of the electronic component.

    Abstract translation: 提供了麦克风封装及其安装结构，允许增加背部体积，麦克风封装包括：封装基板; 声学元件，其安装在所述封装基板上并且具有形成在其下部的空间; 以及安装在所述封装基板上并具有形成在其下部的空间的至少一个电子部件，其中所述封装基板包括连接所述声学元件的空间和所述电子部件的空间的声学体积。

    Micro electro mechanical systems sensor module package and method of manufacturing the same
    5.
    发明授权
    Micro electro mechanical systems sensor module package and method of manufacturing the same 有权
    微机电系统传感器模块封装及其制造方法相同

    公开(公告)号：US09236286B2

    公开(公告)日：2016-01-12

    申请号：US14188161

    申请日：2014-02-24

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Tae Hyun Kim ,  Heung Woo Park

    IPC: G01R33/02 ,  H01L21/70 ,  G01P15/08 ,  G01C19/5769

    CPC classification number: H01L21/70 ,  G01C19/5769 ,  G01P15/0802 ,  G01R33/02 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: Disclosed herein is a MEMS sensor module package. The MEMS sensor module package according to a preferred embodiment of the present invention includes: a printed circuit board (PCB); an application specific integrated circuit (ASIC) stacked on the PCB, one side of the ASIC being wire-bonded to the PCB; a MEMS sensor stacked on the ASIC; and a molding encapsulating the MEMS sensor and the ASIC with a resin. Accordingly, the electrical connection distance between a MEMS sensor and an ASIC is shortened so that electrical characteristic may be improved. Further, a sensor module package may be implemented in an ASIC size, so that size reduction may be achieved to meet the requirements of mobile devices.

    Abstract translation: 这里公开了一种MEMS传感器模块封装。 根据本发明的优选实施例的MEMS传感器模块封装包括：印刷电路板（PCB）; 堆叠在PCB上的专用集成电路（ASIC），ASIC的一侧被引线键合到PCB; 堆叠在ASIC上的MEMS传感器; 以及用树脂封装MEMS传感器和ASIC的模制件。 因此，MEMS传感器和ASIC之间的电连接距离缩短，从而可以提高电特性。 此外，传感器模块封装可以以ASIC尺寸实现，使得可以实现尺寸减小以满足移动设备的要求。

    ANGULAR VELOCITY SENSOR
    6.
    发明申请
    ANGULAR VELOCITY SENSOR 审中-公开
    角速度传感器

    公开(公告)号：US20150219456A1

    公开(公告)日：2015-08-06

    申请号：US14334602

    申请日：2014-07-17

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jong Woon Kim ,  Tae Yoon Kim ,  Seung Mo Lim ,  Heung Woo Park

    IPC: G01C19/5705

    CPC classification number: G01C19/5705 ,  G01C19/56

    Abstract: Disclosed herein is an angular velocity sensor, including: a sensing module including a mass body part which includes a plurality of mass bodies disposed to be parallel with each other, an internal frame which movably supports the mass body, and sensing side flexible parts which rotatably connect the mass body to the internal frame; an external frame supporting the sensing module; and a vibration side flexible part rotatably connecting the sensing module to the external frame, wherein the vibration side flexible part is disposed between the internal frame and the external frame to be parallel with each other with respect to a disposition direction of the mass body part which is disposed in the internal frame.

    Abstract translation: 本文公开了一种角速度传感器，包括：感测模块，包括质量体部分，其包括彼此平行设置的多个质量体，可移动地支撑质量体的内部框架，以及可旋转地 将质量体连接到内部框架; 支撑感测模块的外部框架; 以及振动侧柔性部分，其将所述感测模块可旋转地连接到所述外部框架，其中所述振动侧柔性部分设置在所述内部框架和所述外部框架之间，以相对于所述质量体部分的布置方向彼此平行， 设置在内部框架中。

    MICRO ELECTRO MECHANICAL SYSTEMS SENSOR MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    7.
    发明申请
    MICRO ELECTRO MECHANICAL SYSTEMS SENSOR MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
    微电子机械系统传感器模块包装及其制造方法

    公开(公告)号：US20150153372A1

    公开(公告)日：2015-06-04

    申请号：US14188161

    申请日：2014-02-24

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Tae Hyun Kim ,  Heung Woo Park

    IPC: G01P3/42 ,  H01L21/70

    CPC classification number: H01L21/70 ,  G01C19/5769 ,  G01P15/0802 ,  G01R33/02 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: Disclosed herein is a MEMS sensor module package. The MEMS sensor module package according to a preferred embodiment of the present invention includes: a printed circuit board (PCB); an application specific integrated circuit (ASIC) stacked on the PCB, one side of the ASIC being wire-bonded to the PCB; a MEMS sensor stacked on the ASIC; and a molding encapsulating the MEMS sensor and the ASIC with a resin. Accordingly, the electrical connection distance between a MEMS sensor and an ASIC is shortened so that electrical characteristic may be improved. Further, a sensor module package may be implemented in an ASIC size, so that size reduction may be achieved to meet the requirements of mobile devices.

    Abstract translation: 这里公开了一种MEMS传感器模块封装。 根据本发明的优选实施例的MEMS传感器模块封装包括：印刷电路板（PCB）; 堆叠在PCB上的专用集成电路（ASIC），ASIC的一侧被引线键合到PCB; 堆叠在ASIC上的MEMS传感器; 以及用树脂封装MEMS传感器和ASIC的模制件。 因此，MEMS传感器和ASIC之间的电连接距离缩短，从而可以提高电特性。 此外，传感器模块封装可以以ASIC尺寸实现，使得可以实现尺寸减小以满足移动设备的要求。

    Electronic module and method of manufacturing the same
    8.
    发明授权
    Electronic module and method of manufacturing the same 有权

    公开(公告)号：US10600835B2

    公开(公告)日：2020-03-24

    申请号：US15835701

    申请日：2017-12-08

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Heung Woo Park

    IPC: H01L27/146 ,  H04N5/225 ,  G02B13/16 ,  G02B7/08 ,  G02B5/20

    Abstract: An electronic module includes a first component, a second component, a spacer, and an adhesive portion. The first component includes a first surface. The second component is disposed to be spaced apart from the first surface by a distance of about 40 μm to about 200 μm. The spacer spaces the first component and the second component apart from each other. The adhesive portion is disposed between the first surface and a bonding surface of the spacer facing the first surface. The spacer includes an inner spacer having a ring shape, and an outer spacer surrounding the inner spacer and disposed spaced apart from the inner spacer by 50% or less of an overall width of the inner spacer and the outer spacer, and an overall width of the adhesive portion is 100% to 150% of the overall width of the inner spacer and the outer spacer.

    MICRO ELECTRO MECHANICAL SYSTEMS SENSOR MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    10.
    发明申请
    MICRO ELECTRO MECHANICAL SYSTEMS SENSOR MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    微电子机械系统传感器模块包装及其制造方法

    公开(公告)号：US20150153378A1

    公开(公告)日：2015-06-04

    申请号：US14550851

    申请日：2014-11-21

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Tae Hyun KIM ,  Heung Woo Park ,  Eun Jung Jo

    IPC: G01P15/105

    CPC classification number: G01P1/023 ,  B81B2201/0235 ,  B81B2201/0292 ,  B81B2207/07 ,  B81C1/00238 ,  G01P15/08 ,  G01P15/0802 ,  H01L2224/97 ,  Y10T29/42

    Abstract: Disclosed herein is a micro electro mechanical systems (MEMS) sensor module package. The MEMS sensor module package includes: an MEMS sensor; a base part formed so as to encapsulate the MEMS sensor with a resin; an external terminal provided on one surface of the base part; a through mold via (TMV) provided in the base part to electrically connect the external terminal and the MEMS sensor to each other; and an application specific integrated circuit (ASIC) stacked on the MEMS sensor. Compared to a MEMS sensor module package structure according to the prior art, the present invention is to reduce the entire size and implement electric shielding.

    Abstract translation: 本文公开了一种微机电系统（MEMS）传感器模块封装。 MEMS传感器模块封装包括：MEMS传感器; 形成为用MEMS树脂密封MEMS传感器的基部; 设置在所述基部的一个表面上的外部端子; 设置在基座部分中的通过模具通孔（TMV），以将外部端子和MEMS传感器彼此电连接; 以及堆叠在MEMS传感器上的专用集成电路（ASIC）。 与根据现有技术的MEMS传感器模块封装结构相比，本发明是为了减小整体尺寸并实现电屏蔽。

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