Invention Grant
- Patent Title: Heat reduction using selective insulation and thermal spreading
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Application No.: US15624877Application Date: 2017-06-16
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Publication No.: US10606327B2Publication Date: 2020-03-31
- Inventor: Victor Chiriac , Jorge Rosales , Peng Wang
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/367 ; G06F1/20 ; G03B17/55
Abstract:
Techniques for heat reduction are disclosed. An apparatus may include a heat-generating component, an insulative layer having a first surface in contact with the heat-generating component and a second surface opposite the first surface, and a heat-conducting component disposed on the second surface of the insulative layer.
Public/Granted literature
- US20180368279A1 HEAT REDUCTION USING SELECTIVE INSULATION AND THERMAL SPREADING Public/Granted day:2018-12-20
Information query
