Invention Grant
- Patent Title: Substrate carrier for active/passive bonding and de-bonding of a substrate
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Application No.: US15291762Application Date: 2016-10-12
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Publication No.: US10607870B2Publication Date: 2020-03-31
- Inventor: Jen Sern Lew , Sriskantharajah Thirunavukarasu
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: B25B11/00
- IPC: B25B11/00 ; H01L21/673 ; H01L21/67 ; H01L21/687 ; H01L21/683

Abstract:
Embodiments of substrate carriers which enable active/passive bonding and de-bonding of a substrate are provided herein. In some embodiments, a substrate carrier for holding a substrate comprises a disk formed of a porous material, the disk being formed symmetrically about a central axis and defining a substantially planar upper surface. In some embodiments, the porous material is silicon carbide and the substrate carrier includes a semi-porous surface coating formed atop the upper surface of the disk.
Public/Granted literature
- US20170103908A1 SUBSTRATE CARRIER FOR ACTIVE/PASSIVE BONDING AND DE-BONDING OF A SUBSTRATE Public/Granted day:2017-04-13
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