Invention Grant
- Patent Title: Semiconductor structure with diffusion barrier region and manufacturing method thereof
-
Application No.: US15854769Application Date: 2017-12-27
-
Publication No.: US10608086B2Publication Date: 2020-03-31
- Inventor: Ger-Pin Lin , Tien-Chen Chan , Shu-Yen Chan
- Applicant: UNITED MICROELECTRONICS CORP. , Fujian Jinhua Integrated Circuit Co., Ltd.
- Applicant Address: TW Hsin-Chu CN Quanzhou, Fujian Province
- Assignee: UNITED MICROELECTRONICS CORP.,Fujian Jinhua Integrated Circuit Co., Ltd.
- Current Assignee: UNITED MICROELECTRONICS CORP.,Fujian Jinhua Integrated Circuit Co., Ltd.
- Current Assignee Address: TW Hsin-Chu CN Quanzhou, Fujian Province
- Agent Winston Hsu
- Priority: CN201611246125 20161229
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L21/265 ; H01L29/423 ; H01L29/08 ; H01L21/223 ; H01L29/167 ; H01L23/535

Abstract:
The present invention provides a semiconductor structure, the semiconductor structure includes a substrate, at least one active area is defined on the substrate, a buried word line is disposed in the substrate, a source/drain region disposed beside the buried word line, a diffusion barrier region, disposed at the top of the source/drain region, the diffusion barrier region comprises a plurality of doping atoms selected from the group consisting of carbon atoms, nitrogen atoms, germanium atoms, oxygen atoms, helium atoms and xenon atoms, a dielectric layer disposed on the substrate, and a contact structure disposed in the dielectric layer, and electrically connected to the source/drain region.
Public/Granted literature
- US20180190771A1 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-07-05
Information query
IPC分类: