Invention Grant
- Patent Title: Bonded laser with solder-free laser active stripe in facing relationship with submount
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Application No.: US15431840Application Date: 2017-02-14
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Publication No.: US10608404B2Publication Date: 2020-03-31
- Inventor: Mary Nadeau , Jarrett S. Neiman , Mittu Pannala
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01S5/022
- IPC: H01S5/022 ; H01S5/22 ; H01S5/042

Abstract:
A laser light source, a submount for a semiconductor laser, and a method of providing a laser light source are provided. The laser light source includes a submount with first and second electrical contacts thereon and a trench there-between. A semiconductor laser is bonded to the submount by bonding third and fourth electrical contacts of the laser to the first and second electrical contacts, respectively. The third and fourth electrical contacts of the laser are arranged on opposite side of a laser active stripe, which is arranged over the trench of the submount.
Public/Granted literature
- US20180233880A1 BONDED LASER WITH SOLDER-FREE LASER ACTIVE STRIPE IN FACING RELATIONSHIP WITH SUBMOUNT Public/Granted day:2018-08-16
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