There is provided a wafer making it possible to stably break off the piezoelectric vibrator element. The wafer includes a piezoelectric vibrator element, a frame part, and a connection part adapted to connect the piezoelectric vibrator element and the frame part to each other, and the connection part is provided with a guide part adapted to guide force, which is applied to the connection part from one surface side in the thickness direction of the connection part when breaking off the piezoelectric vibrator element from the frame part at the connection part, to at least one side in the width direction of the connection part.