Disclosed herein a high temperature plasma raw material supply apparatus capable of appropriately supplying high temperature plasma raw materials in which impurities are suppressed to a reservoir reserving high temperature plasma raw material in a liquid state. A tin filling mechanism includes a raw material reservoir unit rotatably arranged and configured to reserve a plurality of high temperature plasma raw materials in a solid state; a supply nozzle configured to supply the high temperature plasma raw materials to an outside of the raw material reservoir unit; a load lock unit provided between a housing and a chamber; and a supply path unit configured to guide the high temperature plasma raw materials supplied from the supply nozzle to the load lock unit. At least a part of the supply path unit is provided with a hole formed smaller than the high temperature plasma raw material in the solid state.