Invention Grant
- Patent Title: C-fed antenna formed on multi-layer printed circuit board edge
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Application No.: US16307244Application Date: 2016-06-06
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Publication No.: US10651557B2Publication Date: 2020-05-12
- Inventor: Zhinong Ying , Kun Zhao
- Applicant: Sony Mobile Communications Inc.
- Applicant Address: JP Tokyo
- Assignee: SONY MOBILE COMMUNICATIONS INC.
- Current Assignee: SONY MOBILE COMMUNICATIONS INC.
- Current Assignee Address: JP Tokyo
- Agency: Tucker Ellis LLP
- International Application: PCT/EP2016/062768 WO 20160606
- International Announcement: WO2017/211378 WO 20171214
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H01Q5/378 ; H01Q21/28 ; H01Q23/00 ; H01Q25/00 ; H01Q21/08

Abstract:
An antenna comprises an antenna patch (121) and an extension patch (125). The extension patch (125) is conductively coupled to the antenna patch (121) and is arranged in plane offset from the antenna patch (121). The antenna patch (121) is formed of multiple conductive strips (122A, 122B) extending in a horizontal direction along an edge of a multi-layer circuit board having multiple layers stacked along a vertical direction. Each of the conductive strips (122A, 122B) of the antenna patch (121) is arranged on a different layer of the multi-layer circuit board. The conductive strips (122A, 122B) of the antenna patch (121) are electrically connected to each other by conductive vias (123) extending between two or more of the conductive strips (122A. 122B) of the antenna patch (121), which are arranged on different layers of the multi-layer circuit board. Similarly, the extension patch (125) is formed of multiple conductive strips extending in the horizontal direction. Each of the conductive strips of the extension patch (125) is arranged on a different layer of the multi-layer circuit board. The conductive strips of the extension patch are electrically connected to each other by conductive vias extending between two or more of the conductive strips of the extension patch, which are arranged on different layers of the multi-layer circuit board.
Public/Granted literature
- US20190305429A1 C-FED ANTENNA FORMED ON MULTI-LAYER PRINTED CIRCUIT BOARD EDGE Public/Granted day:2019-10-03
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